Topography and field effects in the inner side of micro via hole using ToF-SIMS
Journal
Surface and interface analysis
Date
2014.06.16
Abstract
We have developed a simple and powerful method to characterize a topographic structured sample such as micro sized via hole of ball grid array (BGA) using ToF-SIMS. It is named “angled sample holder method”. To remove the shade area by incidence primary ion beam and to extract secondary ions from bottom of via hole, we have used several types of angled sample holders based on simulation results using SIMION code. The angled sample holder method was applied to the investigation of via hole samples with 100?m and 60?m diameter. This method allowed us to characterize the bottom and side wall of via hole in clear.