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Changing the World through Creative Research

Semiconductor Materials

Innovations in materials are crucial to extend and to overcome current Si-technologies. We have strived to search for new materials for channels and components.

Next Generation Semiconductor Materials

New materials for overcoming the limit of Si semiconductor

Overview Semiconductors are widely used in high-tech industries, such as integrated circuit devices, camera image sensors, solar cells, and light emitting devices, because their electric conductivity can be controlled by electric fields and light. Since 1993, Samsung Electronics has been at the forefront of the global memory semiconductor market and has contributed to the growth of global IT technology with unparalleled competitiveness. We will continue to lead strategic areas of the semiconductor market, such as next-generation DRAM, VNAND, 5G modem, AP, and image sensors, by developing advanced materials, processes, and devices.

Technology Trend There is a high demand for improved semiconductor device performance in various fields, such as Mobile, Cloud service, Virtual Reality (VR), Augmented Reality (AR), and Automotive. With the rapid adoption of AI, the demand for new high-speed and low-power semiconductor devices is growing. As a result of these demands and the slowing/end of Moore’s Law, there is the need for 3D stacking of components and for the development of materials / process / device technology to support this effort. In addition, there is an increasing need to introduce new functions through integration of disparate devices.

SAIT Technology SAIT is researching new concepts and devices that can outperform existing silicon devices. We are studying low-power operation and multi-bit memory implementation with next-generation emerging materials, and we are trying to overcome the scaling limit of existing semiconductor devices by studying various semiconductor materials. In addition to the new materials research, we are investigating 3D lamination and bonding of heterogeneous devices for close integration and high-performance operation of semiconductor devices. For example, we are researching technologies to sequentially stack logic, memory, and sensors on a single substrate as needed.